Rework, Modification and Repair of Electronic Assemblies
Also Known As:
SKU191964431
Published by
IPC International Inc, formerly Institute for Printed Circuits
IPC
Publication Date2017-01-01
Pages CountPages396
This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures.
Details
| Language(s) | English |
| ISBN | 978-1-61193-293-5 |
| File Size | 16.4 MB |
Purchase
Right after completing the purchase process, you will immediately get a digital copy of this standard which is:
Not Locked
Printable
Multi-User
$
60.50
