IPC IPC 6012E:2020

IPC 6012E:2020 PDF Download

Standard EN Sample
IPC 6012E:2020 Sample

Qualification and Performance Specification for Rigid Printed Boards

SKU173463929 Published by IPC International Inc, formerly Institute for Printed Circuits IPC Publication Date2020-03 Pages CountPages76
IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012E incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.
Details History and complementary documents History
Language(s)English
ISBN978-1-951577-09-4
File Size7.0 MB
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