IPC 7525B:2011 PDF Download
Handbook / Manual / Guide EN Sample
Stencil Design Guidelines
Also Known As:
SKU124611483
Published by
IPC International Inc, formerly Institute for Printed Circuits
IPC
Publication Date2011-10-01
Pages CountPages34
This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.
Details
| Language(s) | English |
| ISBN | 978-1-61193-020-7 |
| File Size | 4.3 MB |
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