BSI BS EN 60749-40:2011

BS EN 60749-40:2011 PDF Download

Standard EN Sample
BS EN 60749-40:2011 Sample

Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using a strain gauge

SKU149524553 Published by British Standards Institution BSI Publication Date2011-09-30 Pages CountPages26

IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.

Details
DescriptorsIntegrated circuits, Drop tests, Mechanical testing, Semiconductor devices, Electronic equipment and components, Impact testing, Strain measurement, Surface mounting devices, Accelerated testing, Environmental testing, Printed-circuit boards
ICS Codes31.080.01 - Semiconductor devices in general
Language(s)English
ISBN978 0 580 64629 4
File Size1.6 MB
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