BS EN 60749-40:2011 PDF Download
Standard EN SampleSemiconductor devices. Mechanical and climatic test methods. Board level drop test method using a strain gauge
Also Known As:
SKU149524553
Published by
British Standards Institution
BSI
Publication Date2011-09-30
Pages CountPages26
IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.
Details
Descriptors | Integrated circuits, Drop tests, Mechanical testing, Semiconductor devices, Electronic equipment and components, Impact testing, Strain measurement, Surface mounting devices, Accelerated testing, Environmental testing, Printed-circuit boards |
ICS Codes | 31.080.01 - Semiconductor devices in general |
Language(s) | English |
ISBN | 978 0 580 64629 4 |
File Size | 1.6 MB |
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